2023 Nominee

Nick Tidd

Vice President, Global Channel Sales,
HP/Poly

Previous Positions at  
•   VP, Global Partner Organization, Poly
•   SVP, Global Sales, Condusiv Technologies
•   President, North America, D-Link
•   VP, Worldwide Channel Sales
 

With over 30 years of experience leading worldwide channel organizations, Nick Tidd has firmly established himself as an insightful leader committed to taking partner strategies to new heights.

Nick began his channel leadership career at 3Com in the 1990s, where he pioneered industry-first PRM platforms and specialization programs that provided a framework for partners to differentiate themselves and succeed. His innovative programs aligned partners for shared growth.

As channel chief roles at D-Link, Condusiv and Polycom/Poly in the 2000s, Nick built award-winning partner programs from the ground up. His bold vision and flawless execution showed it was possible to disrupt established players through strategic alliances.

At Poly, Nick led the complex integration of two legacy partner programs following the Plantronics acquisition. His strategic leadership ensured continuity for partners during this massive change.

Under Nick's direction, Poly unified its partner experience under one program and PRM, enhancing ease of doing business. He continues to anticipate market trends, evolving partner needs, and drive Poly's channel-first strategy.

However, Nick's impact extends beyond his illustrious career achievements. He is a passionate advocate for partners, selflessly sharing his wisdom to set them up for success. His integrity and heart make him a respected industry voice.

With his pioneering career commitment to channel success, Nick Tidd has more than earned his reputation as a visionary partner growth leader. He richly deserves this recognition.